Bga Stencil Kit, Bga Reballing Stencil, Stable for Laptop CPU Bga Chip Ball Planting - Product Features
- Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads
- This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating
- This reballing station adopt high quality aluminum alloy material as structure, light and durable
- Not easy to oxidize, more wear?resistant, and more suitable for 9mm to 43mm BGA chip ball planting
- Used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
- Warranty not applicable for this product