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2599Bga Stencil Kit, Practical Stable Bga Reballing Stencil, Convenient Wear?Resistant Light for Bga Chip Ball Planting Mobile Phone General Purpose Laptop CPU - Product Features
- Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads
- This reballing station adopt high quality aluminum alloy material as structure, light and durable
- Not easy to oxidize, more wear?resistant, and more suitable for 9mm to 43mm BGA chip ball planting
- This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating
- Used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
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