Inkjet Printer By Kufoo

• Durable and Stable: The air assist pump is stable and reliable. High stability design maintains stable airflow output even after long working hours.
• Low Noise and Vibration: The air assist pump is designed to be silent, and both the internal structure and external vibration dampening feet significantly reduce noise or vibration without affecting cutting accuracy, providing a quiet working environment of less than 40 decibels.
• Slick Surface Edge: The air assist pump of the engraving machine uses air to quickly reduce the surface temperature of the cut object to avoid deformation and discoloration caused by high laser temperature. The powerful airflow blows away residue to ensure a slick surface and cutting edge.
• Easy to Install and Compatible: The engraver air assist pump requires no installation and can be used with the regulator (not included) to adjust the flowing rate within the range, compatible with most laser engravers on the market.
• Faster and Deeper Cutting: The air assisted pump is equipped with strong and high speed airflow to blow away smoke, residue generated during the work of the engraving machine, keeping the laser focused on cutting, speeding up the cutting process and increasing the cutting depth.

• Premium Material: Combining premium aluminum alloy and SK5 steel materials, durable with heat, cold, oxidation, etc.
• Wide Application: Widely used for removing power supply, chip, CPU glue, baseband, edge glue, edge cutting glue, etc.
• Simple Operation: Very simple to operate, does not drop points, does not peel copper, and is easy to clean, and safe.
• Convenient Carry: Designed to have a light weight and a compact size, the IC chip repair blade can be easily carried.
• Ultra Thin Blade: Much more thin than the solder point, the BGA blade enables movement between chip and backplane.

• Ultra Thin Blade: Much more thin than the solder point, the BGA blade enables movement between chip and backplane.
• Wide Application: Widely used for removing power supply, chip, CPU glue, baseband, edge glue, edge cutting glue, etc.
• Convenient Carry: Designed to have a light weight and a compact size, the IC chip repair blade can be easily carried.
• Simple Operation: Very simple to operate, does not drop points, does not peel copper, and is easy to clean, and safe.
• Premium Material: Combining premium aluminum alloy and SK5 steel materials, durable with heat, cold, oxidation, etc.

• Convenient Carry: Designed to have a light weight and a compact size, the IC chip repair blade can be easily carried.
• Ultra Thin Blade: Much more thin than the solder point, the BGA blade enables movement between chip and backplane.
• Wide Application: Widely used for removing power supply, chip, CPU glue, baseband, edge glue, edge cutting glue, etc.
• Premium Material: Combining premium aluminum alloy and SK5 steel materials, durable with heat, cold, oxidation, etc.
• Simple Operation: Very simple to operate, does not drop points, does not peel copper, and is easy to clean, and safe.

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